Company introduction
About Us
Company Profile
Challenge Miracle Top Technology eXpand
C
Challenge
M
Miracle
T
Top Technology
X
eXpand
High-Purity Materials for Semiconductor Parts
CMTX promotes material self-sufficiency and localization to mitigate import and export regulatory risks in markets including China and Japan. Through these initiatives, we have established a distinctive value chain and secured proprietary core technologies.
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Interior and Exterior Views of the Cheonan Material Plant
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Silicon Ingot for Semiconductor Parts
Company-wide Automation and Smart Factory Implementation (AI Process Integration Under Review)
Cleaning / Etching Automated Process (Automation)
Manufacturing Execution System (MES)
Quality Management System (QMS)
Enterprise Resource Planning (ERP)
C Campus(Gumi Plant 1)
M Campus(HEAD OFFICE, Gumi Plant 1)
T Campus(HEAD OFFICE, Gumi Plant 1)
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LAND
9,556㎡
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BUILDING
9,373㎡
One-Stop Processing System for Producing the Highest-Quality Products
Preparation of Silicon Material
Surface Grinding
Shape Machining / Drilling
Measuring
Etching
Polishing/Lapping
Final Cleaning
Final Inspection/Packaging
Si Ingot Preparation (Ingot Production – SELIG)
Surface Grinding (thickness, diameter, and flatness)
Shape Machining (hole, angle, and slot)
Process Measurement (3D, non-contact, and hole roundness)
Etching (DoD removal and surface treatment)
Polishing / Lapping (removal of surface roughness, fit irregularities, and chipping)
Final Cleaning (removal of particle issues)
Final Inspection / Packaging (vacuum packaging for shipment)
Closed-Loop Recycling
CMTX promotes environmental protection and ESG implementation through its closed-loop recycling program, jointly developed with major domestic and global chip makers.
R&D Focus for Technology-Based Growth
“Our Technology Changes the World”
Based on its central research center in Cheonan, CMTX conducts in-depth research on semiconductor materials and components, covering materials, processing (process development), and recycling.
The company continues to expand investment in R&D for 3D measurement equipment, non-contact surface roughness testers, cleaning and etching automation equipment, and process automation technologies.
